tl(bg,rp)a1100(t11) 2007-10-01 1 toshiba led lamps tlbga1100(t11), tlrpa1100(t11) panel circuit indicator ? surface-mount devices ? 3.2 (l) 2.9 (w) 1.9 (h) mm ? uv led chip + rgb phosphor ? colors: bluish green, reddish purple ? topr / tstg = -40 to 100c ? reflow soldering is possible ? applications: automotive use, backlighting, etc. ? standard embossed tape packing: t11 (2000/reel) 8-mm tape reel color and material absolute maximum ratings (ta = 25c) product name forward current i f (ma) please see note 1 power dissipation p d (mw) operation temperature t opr (c) storage temperature t stg (c) tlbga1100 tlrpa1100 30 126 ?40~100 ? 40~100 note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: forward current derating unit: mm jedec D jeita D toshiba D weight: 0.035 g (typ.) product name color material tlbga1100 bluish green gan tlrpa1100 reddish purple gan ambient temperature ta (c) i f ? ta allowable forward current i f (ma) 0 0 20 40 60 80 100 120 5 10 15 20 25 30 35
tl(bg,rp)a1100(t11) 2007-10-01 2 electrical characteristics (ta = 25c) forward voltage v f reverse current v r product name min typ. max i f min typ. max i r tlbga1100 ? 3.5 4.2 ? 0.75 ? tlrpa1100 ? 3.5 4.2 20 ? 0.75 ? 10 unit v ma v ma optical characteristics?1 (ta = 25c) luminous intensity i v product name min typ. max i f available iv rank (note 2) tlbga1100 63 100 320 20 qa / ra / sa tlrpa1100 40 70 200 20 pa / qa / ra unit mcd ma note 2: the specification as following table is used for iv classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of eac h rank be unquestioned. iv rank rank symbol min max pa 40 80 qa 63 125 ra 100 200 sa 160 320 unit mcd mcd optical characteristics?2 (ta = 25c) chromaticity x cx chromaticity y cy product name min typ. max min typ. max i f tlbga1100 ? 0.15 ? ? 0.32 ? tlrpa1100 ? 0.35 ? ? 0.20 ? 20ma note 3: ultraviolet light luminescence these led lamps also emit some uv light. (around 360~400nm) when these led lamps are used for general indicator, it is no problem. however the leds are not recommended for the following applications. (1) prohibition - human eye is damaged by the condensed ligh t. (ex. microscope, outer lens, etc) (2) notice - leds are located at near a skin (the distance is le ss than 20mm), and exposure time is more than 60 min. - photosensitive material is used with these leds in a set. it might be damaged by the light. note 4: do not break, cut or pulverize the products. note 5: this product is designed as a general display li ght source usage, and it has applied the measurement standard that matched with t he sensitivity of human's eyes. therefore, it is not intended for usage of functional application (ex. light source for sensor , optical communication and etc) except general display light source.
tl(bg,rp)a1100(t11) 2007-10-01 3 tlbga1100,tlrpa1100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 300 400 500 600 700 800 tlbga1100 tlrpa1100 i v /i v (20 ma) forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v /i v (20 ma) ? i f 1 2.8 3.0 3.2 3.4 3.6 3.8 4.0 3 10 30 100 ta = 25c 0.01 1 300 30 100 3 10 0.03 0.1 0.3 1 3 5 50 500 ta = 25c ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity wavelength (nm) wavelength characteristic ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . )
tl(bg,rp)a1100(t11) 2007-10-01 4 packaging these led devices are packed in an aluminum envelope with silica gel an d a moisture indicator to prevent moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopened for up to 12 months under the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after the moisture proof bag has been opened, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if, upon opening, the moisture indicator card show s humidity of 30% or above (when the indication color changes to pink) or the expiration da te has passed, the devices should be baked while packed in the tape reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sea ling date, which is imprinted on the same side as this label affixed. 4. repeated baking may cause the pee ling strength of the tape to change, leading to trouble in mounting. also, be sure to prevent damage to the device from static electricity during the baking process. 5. any breakage in the laminate pack ing material will cause th e hermeticity of the product to deteriorate. do not toss or drop the packed devices. mounting method soldering ? reflow soldering ? the products are evaluated using above reflow soldering conditions. no additional test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s ? if the product needs to be performed by other soldering method (ex. wave soldering), please contact toshiba sales representative. recommended soldering pattern 1.65 1.15 2.41 unit: mm 1.65 (*) 60~120 s max 10 s max 240 c max 4 c/s max 140~160 c max 4 c/s max time (s) package surface temperature ( c) temperature profile (example) (*) (*) (*) (*) (*)
tl(bg,rp)a1100(t11) 2007-10-01 5 cleaning when cleaning is required after soldering, toshiba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean trough 750h : (made by kao) pine alpha st-100s : (made by arakawa chemical) toshiba technocare : (made by ge toshiba silicones) (frw-17, frw-1, frv-100) precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other cmponents. tape specifications 1. product number format the type of package used for shipment is denote d by a symbol suffix after the product number. the method of classification is as below. (this method, ho wever, does not apply to products whose electrical characteristics differ from standard toshiba specifications.) (1) tape type: t11 (4-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 +0.1/?0 p 2 2.0 0.05 e 1.75 0.1 w 8.0 0.3 p 0 4.0 0.1 p 4.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 3.5 0.05 b 0 3.7 0.1 d 1 1.5 0.1 k 0 2.3 0.1 tlrpa1100 (t11) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(bg,rp)a1100(t11) 2007-10-01 6 3. reel dimensions unit: mm 4. leader and trailer sections of tape note1: empty trailer section note2: empty leader section 9 0.3 180 +0 ?4 60 13 11.4 1.0 2 0.5 44 (note 1) leading part: 190 mm (min) 40 mm or more (note 2) 40 mm or more
tl(bg,rp)a1100(t11) 2007-10-01 7 5. packing display (1) packing quantity reel 2,000 pcs carton 10,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example: tlrpa1100 (t11) p/n: toshiba type tlrpa1100 addc (t11) q?ty 2,000 pcs lot number key code for tsb 32c 2000 (rank symbol) use under 5-30degc/60%rh within 168h seal date: [[g]]/rohs compatible diffused in ***** *y3804xxxxxxxxxxxxxxxxx* assembled in ***** (2) label location tape reel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side.
tl(bg,rp)a1100(t11) 2007-10-01 8 restrictions on product use 20070701-en general ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity an d vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshib a products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconduct or devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.).these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. unintended usage of toshiba products listed in his document shall be made at the customer?s own risk. ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringement s of patents or other rights of the third parties which may result from its use. no license is granted by implic ation or otherwise under any patents or other rights of toshiba or the third parties. ? please contact your sales representative for product- by-product details in this document regarding rohs compatibility. please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
|
